| Equipment model | AVI-IC-A025C |
|---|---|
| CCDAnalysis accuracy(μm/pixel) | 2.5( front side )、5（back side）（16K High color accuracy CCD） |
| Dimensions(mm) | 1790×2250×1990（L×W×H） |
| Equipment weight（t） | 3 |
| Equipment power（Vac,Hz,KW） | 380，50，16 |
| Processing method | Fully automatic double-sided scanning, NG tank, waiting tank |
| camera type | Black and white / color linear camera |
| Detection area（mm） | 30×50（MIN） 120×260（MAX） |
| CT（pnl/h） | Board width＜40 mm（scan once）：270 40 mm≤Board width＜80 mm（Scan twice）：200 80 mm≤Board width＜120 mm（Scan three times）：140 （Double-sided inspection） |
| Reference format | Gerber (RS274X)、ODB++ |
| Detecting plate thickness（mm） | 0.06-2 |
| Defect confirmation | VRS Offline judgment |
| Defect scope | Copper surface area covered by gold surface/organic soldering flux: scratches, pinholes, gold particles, metal bumps, dents, discoloration, copper leakage, contamination, chips, insufficient etching, over-etching, foreign matter, no gold plating Solder protection area: scratches, exposed copper, foreign matter, ink peeling, ink offset, contamination, ink cracks, short circuit under the ink, etc. |
| Applicable version range | Substrate Type：PBGA、CSP、 RF、 COB、 OSP、BOC、MMG、WBGA、PSAP、MCM-BGA、FCBGA、uBGATM |
| Testing materials | Can be used for FR4, FR5, aluminum substrate, reverse copper foil, etc. |
| Temperature and humidity | 22±2℃，50±10% |