Technology and products

High temperature resistant dust film

Technology & products

High temperature resistant dust film

This product is based on PI substrate and is coated on both sides of the substrate with high-temperature resistant silicone. This product has properties such as high temperature resistance, electrical insulation, and solvent corrosion resistance. It is widely used in high-temperature processes such as cleaning dust inside high-temperature equipment, high-temperature bonding of fixtures, and aluminum substrate processing protection.

Physical parameters

Item High temperature resistant dust film
model INK-PI5105
Item um 50±2 Micrometer
The total thickness of the used layer um 100±7 Micrometer
Low tack 180° peeling force g/25mm 10-20 GB/T2792-1998
High viscosity 180° peeling force g/25mm 350-600 GB/T2792-1998
Elongation at break % ≧ 70 GB/T2792-1998
Tensile Strength Mpa ≧ 180 GB/T2792-1998
Withstand voltage KV 3-4 GB/T2792-1998
Temperature resistance °C 260 Oven actual measurement
Back